“Three Chains”Integration and Coordinated Development of China's Integrated Circuit Industry ——Mechanism Analysis and Empirical Research
Sun Qin1, Liu Jiejiao2,3
1. School of Applied Economics,University of Chinese Academy of Social Sciences,Beijing 102488,China;
2. Business School,Jiangxi Institute of Fashion Technology,Nanchang 330201,China;
3. Institute of Industrial Economics of Chinese Academy of Social Science,Beijing 100006,China
Abstract：The integrated development of“three chains”is the key to realizing the innovation and breakthrough of the industry and the optimization of the industrial structure in the integrated circuit industry.Firstly,it analyzes the theoretical basis of“three chains”integration of the IC industry,the integration mechanism of the industry chain and the innovation chain,the integration mechanism of the industry chain,the innovation chain and the capital chain.The synergy of“three chains”in 2009—2020 is calculated by using a composite system synergy model.The empirical results show that the integration degree of“three chains”of China's integrated circuit industry is relatively low until 2018,and the upward trend is mainly due to the influence of the fluctuation of the orderly degree of the industrial chain and the innovation chain.Judging from the changing trend of the sequence parameters of“three-chain”subsystem,the number of exclusive rights transfer contracts,the sales rate,the amount of financing received in the chip semiconductor industry,the number of integrated circuit manufacturing companies,and the technical integration indicators have a greater impact on“three-chain”degree.Therefore,A science and technology financial system that is compatible with the integration of“three chains”of the integrated circuit industry should be established;Innovative tax reduction and deduction policies for the entire industry chain of the integrated circuit industry should be established;A technology financial system that matches the integrated circuit industry should be formed,and the funding chain should be fully covered;A multi-level talent system for enhancing the overall capability of the innovation chain should be established;the construction of an overall coordination institution for breakthroughs in integrated circuit core technologies should be strengthened,and a complete domestic market support system for improving the integration of the“three chains”should be built.
孙琴, 刘戒骄. 集成电路产业“三链”融合协同发展——机理分析与实证研究[J]. 中国科技论坛, 2023(7): 63-73.
Sun Qin, Liu Jiejiao. “Three Chains”Integration and Coordinated Development of China's Integrated Circuit Industry ——Mechanism Analysis and Empirical Research. , 2023(7): 63-73.
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